Industry News

China's Zoom Inks Licensing Pact with Qualcomm for 3G Phones

3G products By Ashok Bindra, TMCnet Contributor

Chinese mobile phone manufacturer Zoom Technologies has inked a licensing deal with advanced wireless communications chip maker Qualcomm  Inc. for using its patents in the development and manufacture of 3G phones. Under the terms of the agreement, Qualcomm has granted Zoom a worldwide, royalty-bearing patent license to develop, manufacture and sell WCDMA and TD-SCDMA subscriber units. The royalties payable by Zoom are at Qualcomm's standard worldwide rates, according to the company.
 
According to Zoom Technologies, using Qualcomm’s patented technologies, its Nollec Wireless subsidiary will develop highly competitive 3G products, such as smartphones, running on the Android (News - Alert) operating system, for professionals. As a result, it will help the Chinese phone maker to deliver a series of professional use 3G smartphones to Asia, Europe and beyond.

In a statement, said Derek Aberle, executive vice president and president of Qualcomm Technology Licensing, "Qualcomm and Zoom Technologies both share a strong commitment to R&D and are dedicated to driving the wireless industry forward in China and around the world." "This agreement enables them to develop, manufacture and sell advanced 3G products, greatly enhancing Zoom's competitive position in the global wireless landscape," added Aberle.

Likewise, in another statement, Zoom Technologies’ chairman and chief executive officer Leo Gu commented, "This agreement with Qualcomm is an enormous step towards our advancement in the 3G market, enabling us to produce the latest products for the dynamic Chinese market." He added, " Zoom's wholly owned subsidiary Nollec Wireless, a mobile phone and wireless communication design company, will operate under the license.”

Zoom Technologies is a major supplier of cell phones to Chinese carriers such as China Mobile, China Unicom  and China Telecom.


Ashok Bindra is a veteran writer and editor with more than 25 years of editorial experience covering RF/wireless technologies, semiconductors and power electronics. To read more of his articles, please visit his columnist page.
 


 

 

 

 
 
 


 

 


 

Hits:  UpdateTime:2011-04-16 14:53:47  【Printing】  【Close